Electronics & Solar
Semiconductor Manufacturing
Wafer fab, etch, deposition, CMP
AI process intelligence for semiconductor wafer fabrication: connecting etch rate, deposition uniformity, CMP planarization, and yield outcomes across the full fab process flow. The analysis methods below are live on the platform today. Fab-specific integrations and wafer-map intelligence are in active development, so this area is early access.
How Niobia AI helps
Built specifically for semiconductor manufacturing.
Recipe-to-Yield Correlation
The same correlation engine used on deposition and etch data elsewhere on the platform, applied to fab process logs. Available today for teams who can export their run data.
SPC and Capability Analysis
Control charts, Cp/Cpk, and gauge R&R on fab measurements. These are core platform methods and are not fab-specific.
Wafer-Map Intelligence (in development)
Spatial defect clustering and wafer-map signature analysis are being built. Not available yet, and we would rather say so than imply otherwise.
How it works
Three steps to your first insight.
Start with exported process data
Etch, deposition, and CMP run logs plus metrology results. Direct fab-system connectors are not built yet, so this begins with exports.
Run the analysis that already works
Correlation, SPC, capability, and DOE methods are mature on the platform and are chemistry-agnostic.
Shape what gets built next
Early-access teams direct the fab-specific roadmap, including wafer-map intelligence and native tool integrations.
Example questions
Ask Niobia AI anything about your process.
Ready to try it on your data?
Free to start. No data leaves your environment on enterprise plans.